โครงการนี้พัฒนาขึ้นโดยใช้ซอฟต์แวร์สำเร็จรูป SAP ECC 6.0 ระบบจัดการฐานข้อมูล Oracle 10g และมีระบบปฏิบัติการ Microsoft Windows Server 2003
A SAP ECC 6.0 Implementation Project: Material Management Module of Integrated Circuit Manufacturing Business was developed with an aim to configuring the functions of enterprise resource planning software to meet the needs and compliance with the business processes of the integrated circuit business which was taken as a case study. As a result, the information system developed will be an integrated system that connects all related data, can be accessed quickly, and will support to generate reports to management for effective decision analysis and planning.
A SAP ECC 6.0 Implementation Project: Material Management Module of Integrated Circuit Manufacturing Business consists of 5sub-systems, which are Material Data Management System, Material Requirement Planning System, Purchasing System, Inventory Management System, and Management Information System
A SAP ECC 6.0 Implementation Project: Material Management Module of Integrated Circuit Manufacturing Business was developed by using the SAP ECC 6.0 packaged software and has Oracle 10g as the database management system on Microsoft Windows Server 2003 as the operating system.