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TitleCleaning Printed Wiring Assemblies in Today's Environment [electronic resource] / edited by Les Hymes
ImprintDordrecht : Springer Netherlands, 1991
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Descript XIV, 225 p. online resource


The impetus to create this book originated from several concerns. One of these was the perceived value to the industry of a collection in one volume of a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods of dealing with one of the enยญ vironmental issues of our time: the destruction of the ozone layer surrounding and protecting the planet with which we have been entrusted. The volume of information relative to providing PW As free of residues adยญ versely impacting operation, reliability, and life of electronic products is growยญ ing, and it will continue to expand at an accelerated rate as we seek to match our technology needs and desires with our environmental responsibilities. At the time ofthis writing, which has spanned the latter portion of 1989 and early 1990, the issue of choosing a new approach to producing PW As free of detrimental residues while using environmentally acceptable manufacturing techniques apยญ peared to be the major concern of the vast majority of those involved in the printed wiring assembly industry. To many this meant the use of different cleanยญ ing media and/or process or equipment enhancements; to others it meant the elimination of the need to clean through materials or process changes


1 Design and Process Considerations -- 1.1 Overview -- 1.2 Assembly Packaging -- 1.3 Component Packaging -- 1.4 The Printed Wiring Assembly -- 1.5 Assembly and Solder Process -- 1.6 Cleaning Operation -- 1.7 Summary -- References -- 2 Flux Considerations with Emphasis on Low Solids -- 2.1 Introduction -- 2.2 Specifications -- 2.3 Flux Materials -- 2.4 Application Methods -- 2.5 Monitoring Techniques -- 2.6 Process Issues -- 2.7 Nonliquid Fluxes -- 2.8 Importance of Soldering Parameters -- 2.9 Summary and Trends -- References -- 3 Solvent Defluxing of Printed Wiring Board Assemblies and Surface Mount Assemblies: Materials, Processes, and Equipment -- 3.1 The Need for Cleaning -- 3.2 The Cleaning Process -- 3.3 Testing for Cleanliness -- 3.4 Environmental Concerns of Solvents -- 3.5 Conclusion -- References -- 4 Aqueous Defluxing: Materials, Processes, and Equipment -- 4.1 Introduction -- 4.2 Design Considerations -- 4.3 Process Considerations -- 4.4 Process Qualification and Control -- 4.5 Environmental Concerns -- References -- 5 Alternative Defluxing: Materials, Processes, and Equipment -- 5.1 Introduction -- 5.2 Methods and Equipment -- 5.3 Materials -- References -- 6 Defluxing for High Reliability Applications and General Environmental Issues -- 6.1 Introduction -- 6.2 Background -- 6.3 Cleanliness Requirements -- 6.4 Cleaning Materials -- 6.5 Cleaning Equipment -- 6.6 Cleanliness Verification -- 6.7 Environmental Issues -- 6.8 The Future of Cleaning -- 6.9 Conclusions -- References

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