Title | Cleaning Printed Wiring Assemblies in Today's Environment [electronic resource] / edited by Les Hymes |
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Imprint | Dordrecht : Springer Netherlands, 1991 |
Connect to | http://dx.doi.org/10.1007/978-94-011-6967-7 |
Descript | XIV, 225 p. online resource |
1 Design and Process Considerations -- 1.1 Overview -- 1.2 Assembly Packaging -- 1.3 Component Packaging -- 1.4 The Printed Wiring Assembly -- 1.5 Assembly and Solder Process -- 1.6 Cleaning Operation -- 1.7 Summary -- References -- 2 Flux Considerations with Emphasis on Low Solids -- 2.1 Introduction -- 2.2 Specifications -- 2.3 Flux Materials -- 2.4 Application Methods -- 2.5 Monitoring Techniques -- 2.6 Process Issues -- 2.7 Nonliquid Fluxes -- 2.8 Importance of Soldering Parameters -- 2.9 Summary and Trends -- References -- 3 Solvent Defluxing of Printed Wiring Board Assemblies and Surface Mount Assemblies: Materials, Processes, and Equipment -- 3.1 The Need for Cleaning -- 3.2 The Cleaning Process -- 3.3 Testing for Cleanliness -- 3.4 Environmental Concerns of Solvents -- 3.5 Conclusion -- References -- 4 Aqueous Defluxing: Materials, Processes, and Equipment -- 4.1 Introduction -- 4.2 Design Considerations -- 4.3 Process Considerations -- 4.4 Process Qualification and Control -- 4.5 Environmental Concerns -- References -- 5 Alternative Defluxing: Materials, Processes, and Equipment -- 5.1 Introduction -- 5.2 Methods and Equipment -- 5.3 Materials -- References -- 6 Defluxing for High Reliability Applications and General Environmental Issues -- 6.1 Introduction -- 6.2 Background -- 6.3 Cleanliness Requirements -- 6.4 Cleaning Materials -- 6.5 Cleaning Equipment -- 6.6 Cleanliness Verification -- 6.7 Environmental Issues -- 6.8 The Future of Cleaning -- 6.9 Conclusions -- References