Author	Edwards, Phillip R. author
Title	Manufacturing Technology in the Electronics Industry [electronic resource] : An introduction / by Phillip R. Edwards
Imprint	Dordrecht : Springer Netherlands : Imprint: Springer, 1991
Connect to	http://dx.doi.org/10.1007/978-94-011-3130-8
Descript	VIII, 248 p. 69 illus. online resource

The sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices

1 Introduction to the electronics industry -- 1.1 A history of the electronics industry -- 1.2 The electronics market -- 1.3 Electronics manufacturing company structure -- 1.4 Test engineering and quality assurance -- 2 Electronic components -- 2.1 Component interconnection methods -- 2.2 Electronic components -- 2.3 Component packaging -- 2.4 Cabling -- 2.5 Component quality assurance -- 3 Electronic design -- 3.1 Quality and reliability assessment -- 3.2 The product design process -- 3.3 Circuit design -- 3.4 Integrated circuit design -- 3.5 Circuit layout -- 4 Semiconductor device manufacture -- 4.1 Semiconductor materials -- 4.2 Clean room requirements -- 4.3 Silicon wafer manufacture -- 4.4 Photolithography -- 4.5 Layer fabrication processes -- 4.6 Bipolar junction transistor fabrication -- 4.7 Field effect transistor fabrication -- 4.8 Integrated circuit packaging and testing -- 5 Printed circuit board manufacture -- 5.1 Printed circuit board types -- 5.2 Printed circuit board substrate materials -- 5.3 Printed circuit board substrate manufacture -- 5.4 Printed circuit board fabrication procedures -- 5.5 Single-sided printed circuit board manufacture -- 5.6 Double-sided printed circuit board manufacture -- 5.7 Multilayer printed circuit board manufacture -- 6 Printed circuit board assembly -- 6.1 Hand assembly -- 6.2 Automatic component insertion -- 6.3 Assembly-related faults -- 6.4 Soldering techniques -- 6.5 Solder joint inspection and common soldering faults -- 6.6 Cleaning -- 6.7 Testing and reworking -- 7 Surface mount component assembly -- 7.1 Advantages of surface mount components -- 7.2 Surface mount component assembly -- 7.3 Adhesive application -- 7.4 Solder paste application -- 7.5 Component onsertion -- 7.6 Soldering techniques -- 7.7 Mixing surface mount with leaded components -- 7.8 Soldering quality -- 7.9 Testing -- 7.10 Reworking -- 8 Alternative technologies -- 8.1 Hybrid technology -- 8.2 Tape automated bonding -- 8.3 Silicon on silicon wafer-scale integration -- 8.4 Application-specific integrated circuits -- 8.5 Flexible circuits -- References -- Further reading

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