การปรับปรุงกระบวนการขึ้นรูปจากแม่พิมพ์ในอุตสาหกรรมเซมิคอนดักเตอร์ชนิดมีขา / วัลภา เตชะสุข = Molding process improvement in peripheral semiconductor industry / Wallapa Techasuk
Semiconductor is the material that has properties of conductive stay between the conductor and the electric insulator. It is the main part of electrical appliances. This research was to study and solve the problem in peripheral product at the mold process. The problem of the wire touch or the gap between 2 gold wires was less than the standard rule of the product. the gap between gold wires must be wider than 23 micrometer. This research defined the potential factors of the wire touch or gap between the gold wires by utilllizing the fish bone diagram. There were 3 factors which were considered to be the main factors of the problem. Those factor were the injection time, the tablet preheat time and the injection pressure. Central Composite Design (CCD) was employed with the response surface analysis to explore the appropriate parameters which affected the maximum gap of the gold wires. The experimental result showed that the suitable parameters of the mold machine of the wire touch problem were the injection time of 13 sec, the tablet preheat time of 9 sec and the injection force of 1.7 ton, which result in the maximum wire gap of 49 micrometer. We had no problem of the wire touch or gap between gold wiress less than 23 micrometer affer implemented these factors.
