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TitleModern electroplating / edited by Mordechay Schlesinger, Milan Paunovic
Imprint New York : Wiley, 2000
Edition 4th ed
Descript xiv, 868 p. : ill. ; 26 cm

CONTENT

1. Fundamental considerations -- 2. Electrodeposition of copper -- 3. Electrodeposition of nickel -- 4. Electrodeposition of gold -- 5. Electroless and electrodeposition of silver -- 6. Tin and tin alloys for lead-free solder -- 7. Electrodeposition of chromium -- 8. Electrodeposition of lead and lead alloys -- 9. Electrodeposition of tin-lead alloys -- 10. Electrodeposition of zinc and zinc alloys -- 11. Electrodeposition of iron and iron alloys -- 12. Electrodeposition of palladium and palladium alloys -- 13. Nickel alloys, cobalt, and cobalt alloys -- 14. Electrodeposition of semiconductors -- 15. Deposition on nonconductors -- 16. Electodeposition of organic films: conductive polymers -- 17. Electroless deposition of copper -- 18. Electroless deposition of nickel -- 19. Electroless deposition of cobalt alloy films -- 20. Electroless deposition of palladium and platinum -- 21. Electroless deposition of gold -- 22. Electroless deposition of alloys -- 23. Preparation for deposition -- 24. Manufacturing technologies -- 25. Monitoring and control -- 26. Environmental aspects of electrodeposition


Electroplating

LOCATIONCALL#STATUS
Science LibraryTS670 M689s 2000CHECK SHELVES

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