การลดจุดบกพร่องของการประกอบแผ่นลายวงจรพิมพ์ โดยการวิเคราะห์ความสามารถในการผลิต / ทิพรชัย ปราการพิลาศ = Defects reduction of a printed circuit board assembly based on analysis of manufacturing capability / Tipornchai Prakarnpilas
Electrical appliance and electronic industry is the continuing expansion industry but the design of product most come from parent company or the duplicated one. Design input is not relevant to the existing manufacturing capability so many production problems and defects are resulted. The analysis of mauafacturing capability is proposed to solve this problem. Defects reduction of printed circuit board assembly based on the analysis of manafacturing capability are developed. By analysing the causes of PCBA1 model defects, 4 major defects, namely Short, Unsolder, Reverse and Floating, are found. By analysing the manufacturing capability based on 3 M management Man Method and Machine on the defects, their causes are from design that is not suitable for manufacturing capability. Then 2 guidelines for improvement i.e. Design Change and Method Change are proposed to reduce the defects. The result from the proposed guidelines are as follows: Unsolder Problem reduce from 273.0 to 1.41% ; Short Problem reduce from 213.5 to 2.54% ; Floating Problem reduce from 120.5 to 0% ; Reverse Problem reduce from 20.5 to 0% ; Can't do Problem reduce from 200.0 to 0%.